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{"sheet":"RIPEC","index":0,"n_rows":39,"n_cols":15,"rows_kept":39,"cut":false,"hidden":false,"merged":[[0,1,0,2],[2,1,2,2],[1,1,1,2],[5,0,5,6],[9,0,9,6],[15,0,15,6],[23,0,23,6],[33,0,33,6],[34,0,35,0],[36,0,38,0],[36,3,38,3],[36,4,38,4],[36,5,38,5],[29,0,30,0],[16,0,19,0],[26,0,28,0],[20,0,22,0],[36,6,38,6]]}
["Brand name"]
["Product category"]
["Date"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,100]
["Sub-criteria","Sub-sub-criteria","Score","Weight","Score","Score percentage","Impact of each \nsub-sub criterion",null,"Product traceability & \nrepair information access","Design characteristics enhancing circuit repairability","Disassembly/\nreassembly","Diagnostic","Spare parts/components","TOTAL"]
["C1: Product traceability & repair information access",null,null,null,null,null,null,null,{"$f":"(E7*D7/1+E8*D8/4+E9*D9/1)/SUM(D7:D9)*2","v":0},{"$f":"(E11*D11/3+E12*D12/3+E13*D13/2+E14*D14/3+E15*D15/4)/SUM(D11:D15)*1.5","v":0},{"$f":"(E17*D17/3+E18*D18/4+E19*D19/3+E20*D20/3+E21*D21/5+E22*D22/5+E23*D23/5)/SUM(D17:D23)*2","v":0},{"$f":"(E25*D25/1+E26*D26/3+E27*D27/1+E28*D28/3+E29*D29/3+E30*D30/3+E31*D31/4+E32*D32/4+E33*D33/3)/SUM(D25:D33)*2.5","v":0},{"$f":"(E35*D35/4+E36*D36/4+E37*D37/1)/SUM(D35:D37)*2","v":0},{"$f":"SUM(I6:M6)","v":0}]
[{"$f":"Variables!A3","v":"C1.1. Access to digital information"},"-","0: Not available",25,{"$f":"LEFT(C7,1)","v":"0"},{"$f":"E7/1","v":0},{"$f":"F7","v":0},null,{"$f":"10*I6/2","v":0},{"$f":"10*J6/1.5","v":0},{"$f":"10*K6/2","v":0},{"$f":"10*L6/2.5","v":0},{"$f":"10*M6/2","v":0},{"$f":"100*N6/10","v":0}]
[{"$f":"Variables!A5","v":"C1.2. Documentation retention period"},"-","0: Non-available",25,{"$f":"LEFT(C8,1)","v":"0"},{"$f":"E8/4","v":0},{"$f":"F8","v":0},null,{"$f":"100-I7","v":100},100,100,100,100,100]
[{"$f":"Variables!A10","v":"C1.3. Safety documentation"},"-","0: Not available",15,{"$f":"LEFT(C9,1)","v":"0"},{"$f":"(E9/1)","v":0},{"$f":"F9","v":0}]
["C2: Design characteristics enhancing circuit repairability"]
[{"$f":"Variables!A14","v":"C2.1. Security and protection"},{"$f":"Variables!B14","v":"C2.1.1. Presence of security component"},"0: No security components.",15,{"$f":"LEFT(C11,1)","v":"0"},{"$f":"E11/3","v":0},{"$f":"F11","v":0}]
[{"$f":"Variables!A18","v":"C2.2. Limitation of failure propagation"},{"$f":"Variables!B18","v":"C2.2.1. A short circuit or failure (complete circuit opening) at the level of a susceptible to fault component destroys"},"0: The entire board is destroyed.",15,{"$f":"LEFT(C12,1)","v":"0"},{"$f":"E12/3","v":0},{"$f":"F12","v":0}]
[{"$f":"Variables!A22","v":"C2.3. Means to quantify product aging"},{"$f":"Variables!B22","v":"C2.3.1. Presence of a means to quantify product aging"},"0: Not available",10,{"$f":"LEFT(C13,1)","v":"0"},{"$f":"E13/2","v":0},{"$f":"F13","v":0}]
[{"$f":"Variables!A25","v":"C2.4. Modular PCB design"},{"$f":"Variables!B25","v":"C2.4.1. Presence of separable, standardized, and sourceable PCB modules"},"0: No modularity: the PCB is fully monolithic",20,{"$f":"LEFT(C14,1)","v":"0"},{"$f":"E14/3","v":0},{"$f":"F14","v":0}]
[{"$f":"Variables!A29","v":"C2.5. Use of standardized components"},{"$f":"Variables!B29","v":"C2.5.1. Design-time use of standardized components for fail-prone parts"},"0: Custom or proprietary components used, with no available specifications",20,{"$f":"LEFT(C15,1)","v":"0"},{"$f":"E15/4","v":0},{"$f":"F15","v":0}]
["C3: Disassembly/reassembly"]
[{"$f":"Variables!A36","v":"C3.1. Ease of disassembly and reassembly of the casing/PCB accessibility"},{"$f":"Variables!B36","v":"C3.1.1. Disassembly maps & exploded views"},"0: Not available",20,{"$f":"LEFT(C17,1)","v":"0"},{"$f":"E17/3","v":0},{"$f":"F17","v":0}]
[null,{"$f":"Variables!B40","v":"C3.1.2. Ease of disassembly"},"0: Non-removable",20,"0",{"$f":"E18/4","v":0},{"$f":"F18","v":0}]
[null,{"$f":"Variables!B45","v":"C3.1.3. Tools required for disassembly"},"0: Non-removable product",10,"0",{"$f":"E19/3","v":0},{"$f":"F19","v":0}]
[null,{"$f":"Variables!B49","v":"C3.1.4. Type of fastening used"},"0: Neither removable nor reusable: Separation irreversibly damages the interface, preventing reuse (e.g. structural adhesives, potting compounds, torn solder pads, fractured plastic clips).",15,"0",{"$f":"E20/3","v":0},0]
[{"$f":"Variables!A53","v":"C3.2. Ease of disassembly and reassembly of less reliable components"},{"$f":"Variables!B53","v":"C3.2.1. Technique required for desoldering/resoldering less reliable components"},"0: Impossible",20,"0",{"$f":"E21/5","v":0},0]
[null,{"$f":"Variables!B59","v":"C3.2.2. Number of pins/leads (x) on less reliable components (e.g., capacitors, transistors, ICs)"},"0: 24 < x  Very large pin count (e.g., QFP, BGA) – extremely difficult to rework",15,"0",{"$f":"E22/5","v":0},0]
[null,{"$f":"Variables!B65","v":"C3.2.3. Accessibility of solder joints and package type"},"0: No visible access; special tooling needed (BGA/QFN/hidden joints)",20,"0",{"$f":"E23/5","v":0},0]
["C4: Diagnostic"]
[{"$f":"Variables!A73","v":"C4.1. Functional blocks identification"},"-","0: No block marking or visually inferable structure",15,{"$f":"LEFT(C25,1)","v":"0"},{"$f":"E25/1","v":0},{"$f":"F25","v":0}]
[{"$f":"Variables!A75","v":"C4.2. Component identification"},{"$f":"Variables!B75","v":"C4.2.1. Presence of component references (on PCB, body, or in documentation)"},"0: Unidentifiable: No markings",15,"0",{"$f":"E26/3","v":0},0]
[{"$f":"Variables!A79","v":"C4.3. Diagnostic documentation and necessary tools"},{"$f":"Variables!B79","v":"C4.3.1. Availability of diagnostic documentation"},"0: Not available",20,"0",{"$f":"E27/1","v":0},0]
[null,{"$f":"Variables!B81","v":"C4.3.2. Quality of documentation"},"0: No diagnostic documentation is provided",20,"0",{"$f":"E28/3","v":0},0]
[null,{"$f":"Variables!B85","v":"C4.3.3. Diagnostic tool requirements"},"0: Highly specialized or proprietary tools required",15,"0",{"$f":"E29/3","v":0},0]
[{"$f":"Variables!A89","v":"C4.4. Diagnostic reference values"},{"$f":"Variables!B89","v":"C4.4.1. Reference values and measurement points provided in documentation"},"0: Not available",5,"0",{"$f":"E30/3","v":0},0]
[null,{"$f":"Variables!B93","v":"C4.4.2. Test points on the PCB"},"0: Not available",15,"0",{"$f":"E31/4","v":0},0]
[{"$f":"Variables!A98","v":"C4.5. Built-in diagnostic support features"},{"$f":"Variables!B98","v":"C4.5.1. Presence of visual indicators, test points, or error codes"},"0: Not available; diagnosis rely entirely on external probing and documentation",15,"0",{"$f":"E32/4","v":0},0]
[{"$f":"Variables!A103","v":"C4.6. Post-repair qualification tests"},{"$f":"Variables!B103","v":"C4.6.1. Availability of methods to verify restoration of function after repair"},"0: Informal or improvised methods only (e.g., power-on test)",5,"0",{"$f":"E33/3","v":0},0]
["C5: Spare parts/components"]
[{"$f":"Variables!A109","v":"C5.1. Parts availability"},{"$f":"Variables!B109","v":"C5.1.1. Commitment to the duration of spare parts availability (faulty/broken parts and functional parts)"},"0: Not available",25,{"$f":"LEFT(C35,1)","v":"0"},{"$f":"E35/4","v":0},{"$f":"F35","v":0}]
[null,{"$f":"Variables!B115","v":"C5.5.2. Spare parts delivery times"},"0: Not available",10,{"$f":"LEFT(C36,1)","v":"0"},{"$f":"E36/4","v":0},{"$f":"F36","v":0}]
[{"$f":"Variables!A120","v":"C5.2. Economic repair feasibility"},{"$f":"Variables!B120","v":"C5.2.1. Price pre-tax of the most expensive fail susceptible parts (Please enter a number)"},1,25,{"$f":"1-((C37+C38)/2)/C39","v":0},{"$f":"E37","v":0},{"$f":"F37","v":0}]
[null,{"$f":"Variables!B122","v":"C5.2.2. Average price pre-tax of other fail susceptible parts (Please enter a number)"},1]
[null,{"$f":"Variables!B124","v":"C5.2.3. Price pre-tax of the product (Please enter a number)"},1]

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["Table 5. C1: Calculation sheet for product traceability & repair information access."]
["Sub-variable","Sub-sub-variable","Score (S)","W","Score Values"]
["C1.1. Access to digital information","C1.1.1. Access to digital information","0: Not available",5,0]
[null,null,"1: Available",null,1]
["C1.2. Documentation retention period","C1.2.1. Documentation retention period","0: Non-available",4,0]
[null,null,"1: Less than 5 years",null,1]
[null,null,"2: 5 to 7 years",null,2]
[null,null,"3: 7 to 9 years",null,3]
[null,null,"4: more than 9 years",null,4]
["C1.3. Safety documentation",null,"0: Not available",3,0]
[null,null,"1: Available",null,1]
["Table 6. C2: Calculation sheet for the design characteristics enhancing circuit repairability."]
["Sub-variable","Sub-sub-variable","Score (S)","W"]
["C2.1. Security and protection","C2.1.1. Presence of security component","0: No security components.",5,0]
[null,null,"1: Presence of resistance against overvoltage",null,1]
[null,null,"2: Presence of a fuse or equivalent component.",null,2]
[null,null,"3: Presence of other security components (e.g., Zener diodes, dual overvoltage protection, reverse circuit protection).",null,3]
["C2.2. Limitation of failure propagation","C2.2.1. A short circuit or failure (complete circuit opening) at the level of a susceptible to fault component destroys","0: The entire board is destroyed.",5,0]
[null,null,"1: More than ten components are affected.",null,1]
[null,null,"2: More than four components are affected.",null,2]
[null,null,"3: Only the component in question is destroyed.",null,3]
["C2.3. Means to quantify product aging","C2.3.1. Presence of a means to quantify product aging","0: Not available",5,0]
[null,null,"1: Available but inaccessible (e.g., locked in proprietary systems, requires manufacturer-only tools)",null,1]
[null,null,"2: Available and accessible: The product includes aging-monitoring features, and the data is accessible through standard interfaces, diagnostics, or documentation"]
["C2.4. Modular PCB design","C2.4.1. Presence of separable, standardized, and sourceable PCB modules","0: No modularity: the PCB is fully monolithic"]
[null,null,"1: Modules are identifiable, but not physically separable"]
[null,null,"2: Physically separable modules are present, but either use proprietary connectors or cannot be sourced "]
[null,null,"3: Fully modular design: modules are separable, use standardized interconnects, and are readily available as spare parts"]
["C2.5. Use of standardized components","C2.5.1. Design-time use of standardized components for fail-prone parts","0: Custom or proprietary components used, with no available specifications"]
[null,null,"1: Custom components used; partial specifications or markings available, making substitution difficult"]
[null,null,"2: Custom components used, but complete technical specifications are available to enable reproduction or substitution"]
[null,null,"3: Mostly standardized components used; a few custom parts remain but are non-critical or easily substituted"]
[null,null,"4: All fail-prone components are standardized and widely available from multiple suppliers"]
["Table 7. C3: RIPEC calculation sheet for disassembly/reassembly."]
["Sub-variable","Sub-sub-variable","Score (S)","W"]
["C3.1. Ease of disassembly and reassembly of the casing/PCB accessibility","C3.1.1. Disassembly maps & exploded views","0: Not available"]
[null,null,"1: Available, but lacks detail (e.g., generic exploded diagram without step-by-step flow)\t\t\t"]
[null,null,"2: Detailed disassembly instructions are available (e.g., step-by-step, labeled parts, tool requirements)\t\t"]
[null,null,"3: Fully guided disassembly including part IDs, sequence, and reassembly guidance"]
[null,"C3.1.2. Ease of disassembly","0: Non-removable",5,0]
[null,null,"1: Very hard",null,1]
[null,null,"2: Hard",null,2]
[null,null,"3: Moderate",null,3]
[null,null,"4: Easy",null,4]
[null,"C3.1.3. Tools required for disassembly","0: Non-removable product",2,0]
[null,null,"1: Requires proprietary tools",null,1]
[null,null,"2: Requires specific tools",null,2]
[null,null,"3: Can be disassembled common tools",null,3]
[null,"C3.1.4. Type of fastening used","0: Neither removable nor reusable: Separation irreversibly damages the interface, preventing reuse (e.g. structural adhesives, potting compounds, torn solder pads, fractured plastic clips).",2,0]
[null,null,"1: Reusable after refurbishing: Reuse is possible only after interface reconstruction or repair (e.g. solder pad repair or re-plating, repair of damaged screw bosses, removal and replacement of bonded interfaces).",null,1]
[null,null,"2: Reusable after cleaning or minor rework: Reuse requires limited operations without structural reconstruction (e.g. solder removal and pad cleaning with braid/flux, removal of thread-locking residues).",null,2]
[null,null,"3: Reusable directly: Separation and reassembly are possible without soldering, rework, or surface restoration (e.g. screwed, socketed, plugged connections; non-bonded mechanical interfaces)."]
["C3.2. Ease of disassembly and reassembly of less reliable components","C3.2.1. Technique required for desoldering/resoldering less reliable components","0: Impossible",6,0]
[null,null,"1: Oven ",null,1]
[null,null,"2: Microsoldering ",null,2]
[null,null,"3: Conventional SMD soldering",null,3]
[null,null,"4: Conventional through-hole soldering",null,4]
[null,null,"5: None or screws - No complex desoldering technique required, or screws are used for removal.",null,5]
[null,"C3.2.2. Number of pins/leads (x) on less reliable components (e.g., capacitors, transistors, ICs)","0: 24 < x  Very large pin count (e.g., QFP, BGA) – extremely difficult to rework",5,0]
[null,null,"1: 16 < x ≤ 24  High pin count ICs",null,1]
[null,null,"2: 8 < x ≤ 16  Mid-sized ICs (e.g., SOICs)",null,2]
[null,null,"3: 4 < x ≤ 8  Small ICs, relay",null,3]
[null,null,"4: 2 < x ≤ 4  Transistors, optocouplers",null,4]
[null,null,"5: x ≤ 2\t Capacitors, diodes, resistors – easiest to replace",null,5]
[null,"C3.2.3. Accessibility of solder joints and package type","0: No visible access; special tooling needed (BGA/QFN/hidden joints)"]
[null,null,"1: Joints visible but very dense (QFP/fine-pitch SMD)"]
[null,null,"2: Joints accessible-generally with hot air (Standard SMD)"]
[null,null,"3: Solder visible and manually accessible (Through-hole-high pin count)"]
[null,null,"4: Easily accessible with standard tools \t(Through-hole-low pin count)"]
[null,null,"5: Component is mechanically mounted (Socketed or screwed)"]
["Table 8. C4: RIPEC calculation sheet for diagnostic."]
["Sub-variable","Sub-sub-variable","Score (S)","W"]
["C4.1. Functional blocks identification",null,"0: No block marking or visually inferable structure"]
[null,null,"1: Clear, color-coded or visually separated blocks"]
["C4.2. Component identification","C4.2.1. Presence of component references (on PCB, body, or in documentation)","0: Unidentifiable: No markings"]
[null,null,"1: Identifiable via component body markings"]
[null,null,"2: Identified by labels on PCB"]
[null,null,"3: References clearly documented in repair files"]
["C4.3. Diagnostic documentation and necessary tools","C4.3.1. Availability of diagnostic documentation","0: Not available",8,0]
[null,null,"1: Available",null,1]
[null,"C4.3.2. Quality of documentation","0: No diagnostic documentation is provided"]
[null,null,"1: Basic checklist is listed, but without structured guidance"]
[null,null,"2: Partially structured diagnostic support is available, such as informal troubleshooting steps or signal measurement suggestions"]
[null,null,"3: Well-structured fault isolation guides are provided (e.g., signal trees, error code logic, flowcharts)"]
[null,"C4.3.3. Diagnostic tool requirements","0: Highly specialized or proprietary tools required",6,0]
[null,null,"1: Advanced or high-cost tools",null,1]
[null,null,"2: Standard workshop tools",null,2]
[null,null,"3: Basic, widely available tools only\n",null,3]
["C4.4. Diagnostic reference values","C4.4.1. Reference values and measurement points provided in documentation","0: Not available",6,0]
[null,null,"1: Basic voltage listed",null,1]
[null,null,"2: Signal characteristics documented (e.g., shape, timing, amplitude)"]
[null,null,"3: Detailed multi-domain diagnostics (e.g., electromagnetic scans, temperature profiles)"]
[null,"C4.4.2. Test points on the PCB","0: Not available"]
[null,null,"1: Input/output only"]
[null,null,"2: At each conversion stage"]
[null,null,"3: Around less reliable components"]
[null,null,"4: Reference values are consistently marked on silkscreen/test points"]
["C4.5. Built-in diagnostic support features","C4.5.1. Presence of visual indicators, test points, or error codes","0: Not available; diagnosis rely entirely on external probing and documentation"]
[null,null,"1: Basic visual aids (e.g., status LEDs, labeled test points) provide limited fault detection without detailed context"]
[null,null,"2: Intermediate features (e.g., self-test buttons) offer partial diagnostic insight"]
[null,null,"3: Advanced features (e.g., error codes) provide structured guidance for fault isolation"]
[null,null,"4: Multiple diagnostic aids (e.g., error codes + LEDs + test points) work in combination"]
["C4.6. Post-repair qualification tests","C4.6.1. Availability of methods to verify restoration of function after repair","0: Informal or improvised methods only (e.g., power-on test)"]
[null,null,"1: Manual test procedure (e.g., checklists, signal validation) provided by manufacturer, requiring external tools"]
[null,null,"2: PE offers partial automated test capabilities (e.g., on-board diagnostics)"]
[null,null,"3: Full requalification protocol–self-tests, loop-back tests, or software validation"]
["Table 9. C5: RIPEC calculation sheet for spare parts/components."]
["Sub-variable","Sub-sub-variable","Score (S)","W"]
["C5.1. Parts availability","C5.1.1. Commitment to the duration of spare parts availability (faulty/broken parts and functional parts)","0: Not available",3,0]
[null,null,"1: Less than 9 years",null,1]
[null,null,"2: Between 9 and 11 years",null,2]
[null,null,"3: Between 11 and 13 years",null,3]
[null,null,"4: More than 13 years",null,4]
[]
[null,"C5.5.2. Spare parts delivery times","0: Not available",null,0]
[null,null,"1: More than 10 days",null,1]
[null,null,"2: Between 10 and 5 days",null,2]
[null,null,"3: Between 5 and 3 days",null,3]
[null,null,"4: Less than 3 days",null,4]
["C5.2. Economic repair feasibility","C5.2.1. Price pre-tax of the most expensive fail susceptible parts (Please enter a number)",null,3]
[]
[null,"C5.2.2. Average price pre-tax of other fail susceptible parts (Please enter a number)"]
[]
[null,"C5.2.3. Price pre-tax of the product (Please enter a number)"]

{"sheet":"Percentage","index":2,"n_rows":7,"n_cols":3,"rows_kept":7,"cut":false,"hidden":true,"merged":[]}
["Name","Level","Blank"]
[{"$f":"RIPEC!#REF!","v":{"$error":"#REF!"}},{"$f":"RIPEC!N7/100","v":0},{"$f":"1-B2","v":1}]
[{"$f":"RIPEC!I5","v":"Product traceability & \nrepair information access"},{"$f":"RIPEC!I7/10","v":0},1]
["Robustness of circuit to failures",{"$f":"RIPEC!J7/10","v":0},1]
[{"$f":"RIPEC!K5","v":"Disassembly/\nreassembly"},{"$f":"RIPEC!K7/10","v":0},1]
[{"$f":"RIPEC!L5","v":"Diagnostic"},{"$f":"RIPEC!L7/10","v":0},1]
[{"$f":"RIPEC!M5","v":"Spare parts/components"},{"$f":"RIPEC!M7/10","v":0},1]

{"sheet":"Score Meter-v2","index":3,"n_rows":1,"n_cols":7,"rows_kept":1,"cut":false,"hidden":true,"merged":[]}
[11,null,null,null,null,"RIPEC Score",{"$f":"RIPEC!N6/10","v":0}]

{"sheet":"Support","index":4,"n_rows":10,"n_cols":10,"rows_kept":10,"cut":false,"hidden":true,"merged":[[0,0,0,2],[0,4,0,6],[0,8,0,9],[5,4,5,6]]}
["Color Pie Chart (v2)",null,null,null,"Indicator Pie Chart (v2)",null,null,null,"Rating Table"]
["Type","Rating Color","Rating",null,"Score","Indicator","No Fill Part",null,"Sales Score","Rating"]
["First Blank",{"$f":"C3-1","v":0},{"$f":"VLOOKUP(E3,$I$3:$J$7,2,1)","v":1},null,{"$f":"'Score Meter-v2'!G1","v":0},0,{"$f":"2-SUM(E3:F3)","v":2},null,0,1]
["Worst",{"$f":"IF($C$3=ROW(A1),1,0)","v":1},null,null,null,null,null,null,0.2,2]
["Bad",{"$f":"IF($C$3=ROW(B2),1,0)","v":0},null,null,null,null,null,null,0.4,3]
["Average",{"$f":"IF($C$3=ROW(B3),1,0)","v":0},null,null,"Indicator Pie Chart (v1)",null,null,null,0.6,4]
["Good",{"$f":"IF($C$3=ROW(B4),1,0)","v":0},null,null,"Score","Indicator","No Fill Part",null,0.8,5]
["Best",{"$f":"IF($C$3=ROW(B5),1,0)","v":0},null,null,0.45,0,{"$f":"2-SUM(E8:F8)","v":1.55}]
["Last Blank",{"$f":"B10-SUM(B3:B8)","v":4}]
["Half Circle",5]