AVENAS Yvan

 

Docteur en génie électrique /  PhD in Electrical Engineering
Agrégation de Génie Electrique

Responsable de la deuxième année filière IEE de l'ENSE3,
Coordinateur du projet ANR DESTINI.

Management thermique des modules de puissance / Thermal management of power semi-conductor devices
Caractérisation thermique des modules de puissance / Thermal characterization of power modules
Modules de puissance 3D SiC forte densité / High density SiC 3D power modules
 

Electronique, thermique, électronique de puissance / Electronics, heat transfer, power electronics.

Industrielles (Industry) : SAFRAN

Partenaires académiques (Academic partnerships) : SIMAP, SATIE, Ampère, LAPLACE, CEA/INES

1.    C. Perret, Y. Avenas, C. Gillot, J. Boussey, C. Schaeffer, “Integrated cooling devices in silicon technology”, The European Physical Journal Applied Physics 18, pp. 115-123, 2002.

2.    C. Gillot, Y. Avenas, G. Poupon, C. Schaeffer, E. Fournier, “Silicon Heat Pipes Used as Thermal Spreaders”, IEEE Transactions on Components and Packaging Technologies, vol. 26, pp. 332-339, 2003.

3.    M. Ivanova, Y. Avenas, C. Schaeffer, J-B. Dezord, J. Schulz-Harder, “Heat Pipe Integrated in Direct Bonded Copper (DBC) Technology for Cooling of Power Electronics Packaging”, IEEE Transactions on Power Electronics, Volume 21, pp. 1541-1547, 2006.

4.    Y. Berrouche, Y. Avenas, C. Schaeffer, P. Wang, H.C. Chang, “Optimization of High Flow Rate Nanoporous Electroosmotic Pump”, Journal of Fluids Engineering, Volume 130, pp. 081604-1 - 081604-7, 2008.

5.    L. Kamenova, Y. Avenas, C. Schaeffer, G. Kapelski, S. Tzanova, J. Schulz-Harder, “DBC Technology for Extremely Flat Heat Pipe”, IEEE Transactions on Industry Applications, Volume 45, pp. 1763-1769, 2009.

6.    Y. Berrouche, Y. Avenas, C. Schaeffer, P. Wang, H.C. Chang, ”Design of a Porous Electroosmotic Pump, used in Power Electronics Cooling“, IEEE Transactions on Industry Applications, Volume 45, pp. 2073-2079, 2009.

7.    E.Vagnon, P-O. Jeannin, J-C. Crebier, Y. Avenas, ”A Busbar Like Power Module Based On 3D Chip On Chip Hybrid Integration”, IEEE Transactions on Industry Applications, Volume 46, pp. 2046-2055, 2010.

8.    K. Vladimirova, J-C. Crebier, Y. Avenas, C. Schaeffer, “Single die multiple 600V power diodes with vertical voltage terminations and isolation”, Transactions on Power Electronics, vol. 26, pp. 3423 – 3429, 2011.

9.    M. Petit, A. Kedous-Lebouc, Y. Avenas, M. Tawk, “Calculation and analysis of local magnetic forces in ferrofluids”, Electrical Review (Pologne), vol. 9b, pp. 115-119, 2011.

10.  Y. Avenas, L. Dupont, Z. Khatir, “Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters - A Review”, IEEE Transactions on Power Electronics, vol. 27, no 6, pp. 3081-3092, 2012.

11.  Y. Avenas, L. Dupont, “Evaluation of IGBT thermo-sensitive electrical parameters under different dissipation conditions - Comparison with infrared measurements”, Microelectronics Reliability, Vol. 52, no 11, pp. 2617–2626, 2012.

12.  K. Vladimirova, J-C. Crebier, Y. Avenas, C. Schaeffer, “Drift region integrated microchannels for direct cooling of power electronic devices: advantages and limitations”, IEEE Transactions on Power Electronics, Vol. 28, no 5, pp. 2576-2586, 2013.

13.  M. Tawk, Y. Avenas, A. Kedous-Lebouc, M. Petit, “Numerical and experimental investigations of the thermal management of power electronics with liquid metal minichannel coolers”, IEEE Transactions on Industry Applications, Vol. 49, no 3, pp. 1421-1429, 2013.

14.  K. Vladimirova, Y. Avenas, J-C. Crebier, C. Schaeffer, F. Lebouc, M. Tawk, “Modeling of Power Devices with Drift Region Integrated Microchannel Cooler”, Microelectronics Journal, Vol. 44 , pp. 994-1004, 2013.

15.  L. Dupont, Y. Avenas, P-O. Jeannin, “Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermo-sensitive electrical parameters”, IEEE Transactions on Industry Applications, Vol. 49, no 4, pp. 1599-1608, 2013.

16.  B. Youcef, Y. Avenas, “Power electronics cooling of 100W/cm2 using AC electro-osmotic pump”, IEEE Transactions on Power Electronics, Vol. 29 , no 1, pp.449-454, 2014.

17. M. Petit, Y. Avenas, A. Kedous-Lebouc, W. Cherief, E. Rullière, “Experimental Study of a Static System Based on a Magneto-Thermal Coupling in Ferrofluids”, International Journal of Refrigeration, vol. 37, pp. 201-208, 2014.

18.  M. Petit, A. Kedous-Lebouc, Y. Avenas, W. Cherief, E. Rullière, B. Anceau, “Static sample magnetometer: a new characterization method for low permeability materials and ferrofluids”, IEEE Transactions on Magnetics, vol. 50, n°4, pp. 1-4, 2014.

19.  N. Baker, M. Lisserre, L. Dupont, Y. Avenas, “Improved Reliability of Power Modules: A Review of Online Junction Temperature Measurement Methods”, IEEE Industrial Electronics Magazine, vol. 8, n°3, pp. 17-27, 2014.

20. M. Petit, A. Kedous-Lebouc, O. Geoffroy, Y. Avenas, W. Cherief, “Static magnetometer suitable for weakly permeable magnetic fluids - Highlighting method of anisotropy measurements”, European Journal of Electrical Engineering, vol. 17, n°5-6, pp 327-344, 2014.

21.  W. Cherief, Y. Avenas, S. Ferrouillat, A. Kedous-Lebouc, L. Jossic, J. Berard, M. Petit, “Effect of the Magnetic Field Direction on Forced Convection Heat Transfer Enhancements in Ferrofluids”, The European Physical Journal Applied Physics, vol. 71, n°1, pp. 1-10, 2015.

22.  L. Dupont, Y. Avenas, “Preliminary Evaluation of Thermo-Sensitive Electrical Parameters Based on the Forward Voltage for On-line Chip Temperature Measurements of IGBT Devices”, IEEE Transactions on Industry Applications, Vol. 51, no 6, pp. 4688-4698, 2015.

23.  Y. Avenas, L. Dupont, N. Baker, H. Zara, F. Barruel, “Condition Monitoring: A Decade of Proposed Techniques”, IEEE Industrial Electronics Magazine, vol. 9, n°4, pp. 22-36, 2015.

24.  B. Thollin, L. Dupont, Y. Avenas, J. C. Crebier, Z. Khatir and P. O. Jeannin, "Numerical and Experimental Evaluation of the Microsecond Pulsed Heating Curve Technique Dedicated to Die Interconnection Characterization," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no. 6, pp. 835-845, 2016.

25.  J. L. Marchesini, P. O. Jeannin, Y. Avenas, J. Delaine, C. Buttay and R. Riva, "Implementation and Switching Behavior of a PCB-DBC IGBT Module Based on the Power Chip-on-Chip 3-D Concept," IEEE Transactions on Industry Applications, vol. 53, no. 1, pp. 362-370, 2017.

26. W. Cherief, Y. Avenas, S. Ferrouillat, A. Kedous-Lebouc, L. Jossic, M. Petit, "Parameters affecting forced convection enhancement in ferrofluid cooling systems", Applied Thermal Engineering, vol. 123, pp. 156-166, 2017.

27.  M. Dbeiss, Y. Avenas, H. Zara, “Comparison of the electro-thermal constraints on SiC MOSFET and Si IGBT power modules in photovoltaic DC/AC inverters”, Microelectronics Reliability, vol. 78, pp. 65-71, 2017.

28.  G. Perez, G. Chicot, Y. Avenas, P. Lefranc, P-O. Jeannin, D. Eon, N. Rouger, “Integrated temperature sensor with diamond Schottky diodes using a thermosensitive parameter”, Diamond and Related Materials, vol. 78, pp. 83-87, 2017.

29.  S. Boulahrouz, Y. Avenas, A. Chehhat, “CFD Simulation of Heat Transfer and Fluid Flow within Metallic Foam in Forced Convection Environment”, Mechanics and Mechanical Engineering, Vol. 21, No. 3, pp. 611–635, 2017.

30.  I. Ka, Y. Avenas, L. Dupont, M. Petit, “Realization and Characterization of Instrumented Power Diode with Aluminum RTD Sensor – Application to Thermal Impedance Evaluation”, EPE Journal, pp. 1-12, 2017.

31.  V. Samavatian, H. Iman-Eini, Y. Avenas, “An efficient online time-temperature-dependent creep-fatigue rainflow counting algorithm”, International Journal of Fatigue, Volume 116, pp. 284-292, 2018.

32.  V. Samavatian, Y. Avenas, H. Iman-Eini, “Mutual and self-aging effects of power semiconductors on the thermal behaviour of DC-DC boost power converter”, Microelectronics Reliability, Vol. 88-90, pp. 494-499, 2018.

33. D. Guyot, Y. Avenas, A. Gerlaud, J-F. De Palma, “Influence of Power Modules on the Thermal Design of Laminated Busbars”, Electronics (MDPI – Open Source Journal), vol. 7, n°10, 2018.

34.  M. Dbeiss, Y. Avenas, “Power semiconductor ageing test bench dedicated to photovoltaic applications”, IEEE Transactions on Industry Applications, vol.55, no. 3, pp. 3003-3010, 2019.

35.  M. Dbeiss, Y. Avenas, H. Zara and L. Dupont, "A method for accelerated ageing tests of power modules for photovoltaic inverters considering the inverter mission profiles," IEEE Transactions on Power Electronics, vol. 34, no. 12, pp. 12226-12234, 2019.

36.  V. Samavatian, H. Iman-Eini, Y. Avenas and S. Shemehsavar, "Reciprocal and Self-Aging Effects of Power Components on Reliability of DC–DC Boost Converter With Coupled and Decoupled Thermal Structures," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 12, pp. 2506-2513, Dec. 2019. doi: 10.1109/TCPMT.2019.2940058

37.  V. Samavatian, H. Imaneini, Y. Avenas, "Reliability Assessment of Multistate Degraded Systems: An Application to Power Electronic Systems," IEEE Transactions on Power Electronics, vol. 35, no. 4, pp. 4024-4032, 2020. doi: 10.1109/TPEL.2019.2933063.

38.  D. P. U. Tran, S. Lefèbvre, Y. Avenas, "Discrete power semiconductor losses vs junction temperature estimation based on thermal impedance curves," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 1, pp. 79-87, Jan. 2020. doi: 10.1109/TCPMT.2019.2939617.

39.  V. Samavatian, H. Imaneini, Y. Avenas and M. Samavatian, "Effects of Creep Failure Mechanisms on Thermo-mechanical Reliability of Solder Joints in Power Semiconductors," IEEE Transactions on Power Electronics, vol. 35, no. 9, pp. 8956-8964, Sept. 2020, doi: 10.1109/TPEL.2020.2973312.

40.  R. Qaedi, E. Farjah, T. Ghanbari, Y. Avenas, "Online capacitor early ageing monitoring and detection using a dynamic reference model", IET Science, Measurement & Technology, vol. 14, n°9, 2020. doi: 10.1049/iet-smt.2019.0556.

41.  N. Botter, R. Khazaka, Y. Avenas, J.M. Missiaen, D. Bouvard, S. Azzopardi, “Thermal aging of power module assemblies based on ceramic heat sink and multilayers pressureless silver sintering”, Microelectronics Reliability, Volume 126, 2021. doi: 10.1016/j.microrel.2021.114206.